India Semiconductor Mission (ISM) is a specialized and independent Business Division within the Digital India Corporation that aims to build a vibrant semiconductor and display ecosystem to enable India’s emergence as a global hub for electronics manufacturing and design.
Establishing Resilient Supply Chains for Electronics & Semiconductor Manufacturing 18 Jun 2024 Read More
Revised Guidelines for effective functioning of the Modified scheme for setting up of Compound Semiconductors / Silicon Photonics / Sensors Fab/ Discrete Semiconductors Fab and Semiconductor Assembly, Testing, Marking and Packaging (ATMP) 30 Jun 2023 Read More
Guidelines for Modified Scheme for setting up of Semiconductor Fabs in India 30 Jun 2023 Read More
Guidelines for Modified Scheme for setting up of Display Fabs in India 29 May 2023 Read More
The Scheme for setting up of Semiconductor Fabs in India shall extend fiscal support of up to 50% of project cost on pari-passu basis to the approved applicants. The scheme shall be appraised by the Expenditure Finance Committee chaired by Secretary, Department of Expenditure. The Expenditure Finance Committee shall determine the structure and quantum of fiscal support under the scheme for establishing the semiconductor fabs.
The Scheme for setting up of Display Fabs in India shall extend fiscal support of up to 50% of project cost on pari-passu basis to the approved applicants. The scheme shall be appraised by the Expenditure Finance Committee chaired by Secretary, Department of Expenditure. The Expenditure Finance Committee shall determine the structure and quantum of fiscal support under the scheme for establishing the display fabs.
The Scheme for setting up of Compound Semiconductors / Silicon Photonics / Sensors (including MEMS) Fabs / Discrete Semiconductors Fab and Semiconductor ATMP / OSAT facilities in India shall extend fiscal support of 50% of capital expenditure to Compound Semiconductors / Silicon Photonics / Sensors (including MEMS) Fabs and Semiconductor Packaging (ATMP / OSAT) units.
The Design Linked Incentive (DLI) Scheme aims to offer financial incentives as well as design infrastructure support across various stages of development and deployment of semiconductor design(s) for Integrated Circuits (ICs), Chipsets, System on Chips (SoCs), Systems & IP Cores and semiconductor linked design(s) over a period of 5 years.