3.2.5 Fiscal Support
| S. No. | Support Structure | # | Eligible Applicants |
Category of Support and its Quantum |
Mode of Support |
|---|---|---|---|---|---|
| 1 | Design Infrastructure Support (DIS) | (a) | Indian academic institutions and eligible startups and MSMEs | Centralized access to critical EDA Tools grid | Access will be provided to the eligible organizations as per the terms and conditions of the respective contracts with the vendor companies. |
| (b) | Centralized access to Multi-project Wafer (MPW) fabrication services | ||||
| (c) | All eligible applicants as per section 3 above | IP Cores | |||
| (d) | Campus Sub-System (CSS) | ||||
| (e) | Post-silicon validation services access | ||||
| 2 | Product Design Linked Incentive (P-DLI) | (a) | Eligible start-up MSMEs |
Seed funding
(up to ₹15 crore) |
Milestone-linked advance seed funding according to 50% of the project cost or ₹15 crore, whichever is lower, will be provided per application. |
|
Equity co-investment
(beyond ₹15 crore) |
Equity co-investment shall be provided to companies that have raised funding from Venture Capital (VC) and/or Private Equity (PE) investors, on terms and conditions similar to those offered by the VC/PE investors. | ||||
| (b) | Eligible Companies (as per section 3.2.3 above) other than start-up/MSMEs | Royalty financing | Royalty financing shall be provided to the companies on a co-investment basis, subject to the condition that the beneficiary company shall pay a royalty of 5% of net revenues of the product/technology until an amount equivalent to 1.5 times the financial support provided has been recovered. | ||
| Equity co-investment | Equity co-investment shall be provided to the companies that have raised funding from Venture Capital (VC) and/or Private Equity (PE) investors, on terms and conditions similar to those offered by the VC/PE investors. |