SEMICON 2.0 - Building on the successful implementation of the first phase of the Semicon India Programme (Semicon 1.0), the Union Cabinet has approved the next phase of Semicon India Programme (Semicon 2.0) with a fiscal outlay of ₹ 1,27,500 crore to accelerate the development of a robust and resilient semiconductor ecosystem in India.

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Semiconductor Manufacturing Ecosystem

1. Objective

To build a self-reliant and globally competitive semiconductor manufacturing ecosystem and enabling its participation in the global electronics value chains.

2. Target Segment

  • Setting up R&D facilities for semiconductor equipment.
  • Manufacturing facilities for semiconductor-grade raw materials.
  • Manufacturing and/or assembly of capital equipment/refurbished equipment, their sub-assemblies and components for use in semiconductor fabrication and packaging facilities.
  • Semiconductor test and characterization facilities.

3. Eligibility and Fiscal Support

The applicants are expected to "Own or possess licensed technologies for the proposed unit" , except for the Test and characterisation facility.

The eligible sub-verticals, their capital investment threshold and fiscal support from Government of India are listed below:

S.N. Eligible Sub-Verticals Minimum Capital
Investment Threshold
Minimum Revenue Threshold Including Group Companies in any of the three FYs preceding the year of application submission Fiscal Support from Government of India
(a) Setting up R&D facilities for semiconductor equipment. ₹300 crore ₹120 crore 30% of Capital Expenditure on pari-passu basis.
(b) Setting up manufacturing facilities for semiconductor grade Raw Materials (including Back-end), such as, but not limited to:
Wafer, Photo mask, Photoresists, Substrate, chemicals, gases, materials, glass for display fab etc.
₹50 crore ₹20 crore 30% of Capital Expenditure on pari-passu basis.
(c) Semiconductor Test and characterization Facilities ₹100 crore ₹40 crore 30% of Capital Expenditure on pari-passu basis.
(d) Manufacturing and/or Assembly of Equipment/refurbish Equipment, Sub-Assemblies, Components for use in all semiconductor fabrication and packaging facilities. ₹300 crore ₹120 crore 30% of Capital Expenditure on pari-passu basis.
Production Linked Incentive (PLI) 10% / 8% / 6% / 4% / 2% of BoM value sourced from domestic manufactures. The PLI incentive will be applicable for 5 years starting from FY 2028-29 subject to an overall ceiling of 50% of capex.

4. Project Duration

The duration of the projects to be supported under this scheme shall be determined on project-to-project basis, preferably up to 6 years.

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Notifications

APPLICATION PROCEDURE
  • The scheme shall be initially open for applications for a period of Three (3) years.
  • Applications are to be submitted through the portal of the Nodal Agency during the application window.
01 Registration

Registration

Submission of relevant information to register with ISM and submit application.

02 Proposal

Proposal

Detailed Project Report.

03 Payment of Fee

Payment of Fee

Application fee as per Scheme and Guidelines.

*Fee shall be inclusive of GST however the transaction charges are to be borne by the Applicant independently.
04 Fiscal Support

Fiscal Support

The tenure of the fiscal support shall be for a period of 6 years.